IEEE.org| IEEE Xplore Digital Library| IEEE Standards| IEEE Spectrum| More Sites

Cart (Loading....) | Create Account | 

Close category search window
Author Searchbeta |  Advanced Search  |  Preferences |  Search Tips  |  More Search Options  
 
Browse Journals & Magazines > Computer-Aided Design of Inte ...> Volume:10 Issue:9 Help

The intertool profile interchange format: an object-oriented approach [semiconductor technology CAD/CAM]

Full Text Sign-In or Purchase

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing! close button
puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Boning, D.S. ; Microsyst. Technol. Lab., MIT, Cambridge, MA, USA ; Heytens, M.L. ; Wong, A.S.

A formal object-oriented approach to the data structuring and data management of semiconductor wafer structure and device information is presented. The profile interchange format (PIF) is extended beyond a file format `intersite' version in order to enhance the storage and access of profile information, the communication of profile information between cooperating tools, and the integration and portability of technology CAD (computer-aided design) tools. An intertool PIF toolkit is a programmatic interface to profile information, consisting of a library of objects for the storage and manipulation of data by technology CAD tools. PIF/Gestalt is presented as a test implementation of the toolkit which provides C and Common Lisp language interfaces, implemented on a database for use in a CAD/CIM (computer integrated manufacturing) system for semiconductor process design and fabrication

Published in:
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on  (Volume:10 ,  Issue: 9 )

Date of Publication: Sep 1991

Page(s):
1150 - 1156
ISSN :
0278-0070
INSPEC Accession Number:
4025289
Digital Object Identifier :
10.1109/43.85761
Product Type:
Journals & Magazines
Date of Current Version :
06 August 2002
Issue Date :
Sep 1991
Sponsored by :
IEEE Council on Electronic Design Automation

IEEE Account

Purchase Details

Profile Information

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.