Cart (Loading....) | Create Account
Close category search window
 

Characterization of a flip-chip interconnect at frequencies up to 30 GHz

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Szymanowski, M. ; Dept. of Electr. & Comput. Eng., Waterloo Univ., Ont., Canada ; Safavi-Naeini, S.

In this paper, a coplanar-waveguide on the mother board connected by a bump with another coplanar-waveguide on the chip is analyzed in the range of frequencies between 1 GHz and 30 GHz. Various package-schemes of a flip-chip are presented and analyzed. The variations include the length of the overlap of the cpw on the mother-board and the cpw on the chip. It is concluded that the overlap of the coplanar waveguides is one of the most important parameters which determine the characteristics of the bump-connection. Based on the S-parameters, the important physical parameters of the bump-connections are analyzed and recommendations are made concerning the bump connection. The S-parameters are used in order to calculate the Y-parameters, from which the circuit model is obtained. The parameters of the circuit model are calculated and demonstrated for frequencies between 1 GHz and 30 GHz. The results presented in this paper are obtained by a method of moment

Published in:

Electrical and Computer Engineering, 2000 Canadian Conference on  (Volume:2 )

Date of Conference:

2000

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.