Referenced Items are not available for this document.
Several wafer level chip scale package (WLCSP) technologies have been developed which generate fully packaged and tested chips on the wafer prior to dicing. Many of these technologies are based on simple peripheral pad redistribution technology followed by attachment of 0.3-0.5 mm solder balls. The larger standoff generated by these solder balls result in better reliability for the WLCSP's when underfill is not used than for equivalent flip chip parts. RambusTM RDRAM and integrated passives are two applications that should see wide acceptance of WLCSP packages
Published in:
Advanced Packaging, IEEE Transactions on
(Volume:23
,
Issue:
2
)
Date of Publication: May 2000
- Page(s):
- 198 - 205
- ISSN :
- 1521-3323
- INSPEC Accession Number:
- 6625734
- Digital Object Identifier :
- 10.1109/6040.846634
- Product Type:
- Journals & Magazines
- Date of Current Version :
- 06 August 2002
- Issue Date :
- May 2000
- Sponsored by :
- IEEE Components, Packaging, and Manufacturing Technology Society
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