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Agilent technologies' singlemode small form factor (SFF) module incorporates micromachined silicon, automated passive alignment, and non-hermetic packaging to enable the next generation of low-cost fiber optic transceivers

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1 Author(s)
Owen, M. ; Fiber Components Div., Agilent Technol., Suffolk, UK

Agilent Technologies (formerly Hewlett-Packard) are currently manufacturing a range of multimode and singlemode (SM) SFF transceivers with data rates from 125 Mb/s to 1.25 Gb/s (higher data rates are being developed). This paper will address the singlemode module design, assembly techniques and performance. The SFF transceivers offer the same functionality as SC duplex transceivers but utilize the mini MT-RJ optical interface in order to achieve twice the port density. Test results that demonstrate the performance of the mini MT-RJ optical interface will be presented. The SFF modules are price competitive with SC duplex modules, and are designed to enable low cost, high volume manufacture. In order to meet the size constraints and achieve low manufacturing costs, the SM SFF transceiver utilizes silicon as a base to support the optical fibers and active components, and as an aid to passively align of the active components to the fibers. Most other passively aligned modules require the use of a more expensive expanded mode region laser diode (LD). But Agilent Technologies have developed a unique passive align and attach system that can easily achieve the required coupling power for fast ethernet, OC3 and gigabit ethernet using a standard 1300 mn Strained Multiquantum Well (SMQW) LD. The module design and the methods used for passive align will be discussed, as will the precision die attach (PDA) equipment. All precious Agilent Technologies/Hewlett-Packard SM modules relied on an Hermetic cavity around the active devices to achieve the reliability assurance, e.g., as defined in Bellcore TA-NWT-000983, but this type of Hermetic design has limited potential for cost reduction. The SM SFF module is designed to meet the same assurance levels, but uses silicone encapsulation in place of Hermeticity, and the results of the qualification testing will be presented

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Advanced Packaging, IEEE Transactions on  (Volume:23 ,  Issue: 2 )