Referenced Items are not available for this document.
In this letter, we present a study of imaging using a 128/spl times/128-pixel microbolometer focal plane array (FPA) under varying pressure conditions from 10/sup -5/ torr to the ambient. We have employed bulk micromachining in the fabrication of FPA to reduce the thermal conduction through the air-gap between the membrane and the substrate of the microbolometers. It was found that an image of a soldering iron (200/spl deg/C) was clearly visible even at the ambient pressure. However, at ambient pressure, the increased in thermal conductance resulted in a reduction of contrast of the image compared to the ones obtained at low pressure. The results suggest the possibility of operation of uncooled FPA's under ambient pressure by proper design of the microbolometer structure.
Published in:
Electron Device Letters, IEEE
(Volume:21
,
Issue:
5
)
Date of Publication: May 2000
- Page(s):
- 233 - 235
- ISSN :
- 0741-3106
- INSPEC Accession Number:
- 6607166
- Digital Object Identifier :
- 10.1109/55.841306
- Product Type:
- Journals & Magazines
- Date of Current Version :
- 06 August 2002
- Issue Date :
- May 2000
- Sponsored by :
- IEEE Electron Devices Society
About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies
A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.
