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Analysis of ground-bounce induced substrate noise coupling in a low resistive bulk epitaxial process: design strategies to minimize noise effects on a mixed-signal chip

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2 Author(s)
M. Felder ; Wireless Subscriber Syst. Group, Motorola Inc., Austin, TX, USA ; J. Ganger

The industry trend toward system-on-chip solutions continues to push the limits of mixed-signal design. Increasing the integration of analog and digital circuitry causes a struggle to maintain analog signal integrity. Digital switching of noise coupling through the common substrate is both difficult to measure and difficult to control. This paper introduces and applies a practical first-order simulation methodology for performing a substrate noise analysis in a low resistive bulk process. Although this subject has been analyzed in numerous journal articles, few have applied their analysis method to a whole-chip design. This SPICE model will allow mixed-signal designers to determine design variables that will minimize substrate noise. This work elaborates on key aspects of substrate noise that available references do not handle adequately, including: sources of substrate noise, determination of power-rail and bulk-resonance frequencies, and alternatives for bulk biasing. The new model is used to analyze Motorola's 56824, the latest low-cost 16-bit digital signal processor design. The analysis includes the determination of: (1) the on-chip bus and I/O bus noise coupled to the substrate; (2) the dominant resonant frequencies in the chip; and (3) the best bulk-biasing alternative

Published in:

IEEE Transactions on Circuits and Systems II: Analog and Digital Signal Processing  (Volume:46 ,  Issue: 11 )