Scheduled System Maintenance on May 29th, 2015:
IEEE Xplore will be upgraded between 11:00 AM and 10:00 PM EDT. During this time there may be intermittent impact on performance. We apologize for any inconvenience.
By Topic

High density optical interconnect for board and backplane applications using polymer waveguides and VCSEL array devices

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Liu, Y.S. ; GE Corp. Res. & Dev., Schenectady, NY ; Rowlette, J. ; Liu, Y.

Data link components are demonstrated based on 850 nm vertical cavity lasers (VCSELs) and short wavelength GaAs PIN detectors. These components are the foundation of an array data link solution set and offer easy incorporation with traditional multimode fiber based backplanes, or polymer waveguide based backplanes

Published in:

Lasers and Electro-Optics Society Annual Meeting, 1998. LEOS '98. IEEE  (Volume:2 )

Date of Conference:

3-4 Dec 1998