Referenced Items are not available for this document.
The effect of lot size change on the current final test process efficiency and cost due to the transition of from conventional 5 or 6 inches to 300 mm (12 inches) in wafer size is evaluated through simulation analysis. Results show that high test efficiency and low test cost are maintained regardless of lot size in the 300 mm wafer range from one sheet to 25 sheets by using an appropriate dispatching rule and a small processing and moving lot size close to the batch size of testing equipment in the final test process
Published in:
Advanced Semiconductor Manufacturing Conference and Workshop, 1998. 1998 IEEE/SEMI
Date of Conference: 23-25 Sep 1998
- Page(s):
- 151 - 155
- Meeting Date :
- 23 Sep 1998-25 Sep 1998
- ISSN :
- 1078-8743
- Print ISBN:
- 0-7803-4380-8
- INSPEC Accession Number:
- 6239920
- Conference Location :
- Boston, MA
- Digital Object Identifier :
- 10.1109/ASMC.1998.731478
- Product Type:
- Conference Publications
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