Referenced Items are not available for this document.
A study is made of the tendency of growth of delamination between dissimilar materials occurring in large scale integration (LSI) plastic packages under temperature cyclic loading. Two groups of delamination growth processes are considered; one along the interface between the top surface of the die pad and the die-bonding layer, and the other along the interface between the bottom surface of the die pad and the encapsulant resin. In each group several different initial patterns of delaminations are assumed. Stress intensity factors and their mode ratios at the tips of growing delaminations are calculated by combining a thermoelastic finite element method for nonlinear contact problems and a linear interface fracture mechanics approach. The effects of geometries of delamination and leadframe materials on the tendency of delamination growth are clarified
Published in:
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
(Volume:21
,
Issue:
4
)
Date of Publication: Nov 1998
- Page(s):
- 422 - 427
- ISSN :
- 1070-9894
- INSPEC Accession Number:
- 6105031
- Digital Object Identifier :
- 10.1109/96.730424
- Product Type:
- Journals & Magazines
- Date of Current Version :
- 06 August 2002
- Issue Date :
- Nov 1998
- Sponsored by :
- IEEE Components, Packaging, and Manufacturing Technology Society
About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies
A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.
