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Polymeric conductive pastes as solder replacement for flip-chip attachment

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4 Author(s)
Kaoru U. Maner ; University of Arkansas, Fayetteville, AR 72701 USA ; Simon S. Ang ; Leonard W. Schaper ; William D. Brown

The fabrication and characterization of flip-chip assemblies using four polymeric conductive pastes as attachment materials are reported. Three thermoset and one thermoplastic polymeric conductive pastes were investigated. Polymeric conductive pastes having silver particles 2 μm in size made good contact to either smooth or rough metal. Electrical contact with pastes whose particles were 5 μm or larger could only be obtained on rough metal.

Published in:

IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B  (Volume:21 ,  Issue: 4 )