By Topic

A heat dissipation tutorial for wearable computers

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
T. Starner ; Media Lab., MIT, Cambridge, MA, USA ; Y. Maguire

Wearable computing brings computation much closer to the user for everyday tasks and may be worn during most of the day. However, with CPU and wireless network intensive applications, higher power microprocessors and radio links are necessary resulting in increased heat generation. This paper suggests a method to increase the hear dissipation capability per unit surface area of a mobile computer by coupling it to the user. In addition, this paper presents tools and guidelines for determining the placement of heat dissipating components.

Published in:

Wearable Computers, 1998. Digest of Papers. Second International Symposium on

Date of Conference:

19-20 Oct. 1998