By Topic

Thermal conductivity and specific heat determinations of a set of lead-free solder alloys

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
L. Kehoe ; Nat. Microelectron. Res. Centre, Cork, Ireland ; G. M. Crean

With the elimination of lead-based solders from electronics manufacturing there is a need to understand the properties of their replacement alloys. In particular measurements of the thermal properties of the replacement alloys are critical for quality control as well as for reliability of the lead free solder joints. This paper will address the determination of the thermal diffusivity and heat capacity of a range of lead-free solder alloys based on Sn/Ag/Cu. Utilising the Laser Flash Technique and Differential Scanning Calorimetry the thermal conductivity will then be determined by a combination of these two properties and the alloy density. A comparison of the thermal conductivity determined from SnPb37 will be made

Published in:

Advanced Packaging Materials, 1998. Proceedings. 1998 4th International Symposium on

Date of Conference:

15-18 Mar 1998