Scheduled System Maintenance:
On May 6th, single article purchases and IEEE account management will be unavailable from 8:00 AM - 12:00 PM ET (12:00 - 16:00 UTC). We apologize for the inconvenience.
By Topic

Efficient transient simulation of high-speed interconnects characterized by sampled data

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Beyene, W.T. ; Hewlett-Packard Co., Westlake Village, CA, USA ; Schutt-Aine, J.E.

In this paper, we present an algorithm for efficient simulation of high-speed interconnects characterized by sampled data. The method constructs pole-zero models of arbitrary interconnects using robust rational approximations of the measured or simulated scattering parameters. In order to obtain accurate interpolations of the data over a wide frequency range, a set of powerful techniques is applied to deal with the resulting ill-conditioned Vandermonde-like approximation matrices. By utilizing the analytic properties of the scattering parameters, the algorithm efficiently generates multiport pole-residue models. The models are combined with the lumped/distributed components for direct time- or frequency-domain simulations. The method can easily be implemented into conventional simulators such as simulation program with integrated circuit emphasis (SPICE) and advanced statistical analysis program (ASTAP) or reduced-order modeling techniques such as asymptotic waveform evaluation (AWE), complex frequency hopping (CFH), and Padd approximation via Lancros Process (PVL) for transient simulation of high-speed interconnect networks. Examples of linear and nonlinear networks are given to demonstrate the validity and accuracy of the method

Published in:

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:21 ,  Issue: 1 )