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CFD applied to electronic systems: a review

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1 Author(s)
P. G. Tucker ; Dept. of Appl. Phys. & Electron. & Manuf. Eng., Dundee Univ., UK

The application of commercial and noncommercial computational fluid dynamics (CFD) programs to systems relevant to electronics is reviewed. The following commercial programs are discussed: THEBES, FLOTHERM, FLUENT, FLOTRAN, FIDAP/ICEPAK, CFX 4 (formerly CFDS-FLOW3D), PHOENICS/HOTBOX, and STAR-CD. Notably, of the noncommercial programs, work utilizing a spectral element program originating from the Massachusetts Institute of Technology (MIT) is described. General thermofluid capabilities, user friendliness, and other peripheral aspects, such as the modeling of thermal stress/strain and dust transport are assessed. For all comparisons with measurements, agreement was found to be within 30%. No commercial CFD program appeared to be clearly superior for all applications, but FLOTHERM had the most use for realistic cooling design problems

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IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A  (Volume:20 ,  Issue: 4 )