By Topic

Is the maximum acceleration an adequate criterion of the dynamic strength of a structural element in an electronic product?

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Suhir, E. ; Bell Labs., Lucent Technol. Inc., Murray Hill, NJ, USA

The dynamic strength of structural elements of micro- and portable electronic products is often evaluated on the basis of the measured maximum acceleration which these elements experience during shock or drop tests. It is well known, however, that it is the dynamic stress, not the acceleration, which is a true criterion of the dynamic strength. Using examples of structural elements that can be idealized as a simply supported beam or a cantilever beam with a concentrated mass at the end, we show that for elements of the given geometry and weight, the level of the maximum stress can be indeed judged upon on the basis of the measured acceleration. However, the application of the measured acceleration as a criterion of the dynamic strength can be misleading if applied to elements of different dimensions, weight and materials. We conclude that although the maximum acceleration is substantially easier to measure, it is the maximum dynamic stress that should be evaluated experimentally or theoretically when there is a need to establish the level of the dynamic strength of a structural element of an electronic product and the role of different factors affecting this strength. The obtained information can be helpful when evaluating the results of, or designing drop tests for electronic products

Published in:

Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on  (Volume:20 ,  Issue: 4 )