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The packaging of large spot-size optoelectronic devices

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7 Author(s)
Collins, J. ; Labs., BT&D Technol. Ltd., Ipswich, UK ; Lealman, I.F. ; Fiddyment, P.J. ; Thurlow, A.R.
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The demand for more bandwidth to the home is starting to drive optical fiber telecommunication systems further into the access network. For fiber systems to reach directly into customer premises the cost of the optoelectronic receivers and transmitters have to be significantly reduced. The major cost of producing these components is the active alignment step to couple an optical fiber to the semiconductor device. This paper details how by matching the output radiation pattern of the device to the input radiation pattern of an optical fiber low-cost passive alignments processes can be utilized

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Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:20 ,  Issue: 4 )