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A review of thermal enhancement techniques for electronic systems

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1 Author(s)
L. S. Fletcher ; Dept. of Mech. Eng., Texas A&M Univ., College Station, TX, USA

Thermal enhancement techniques for maximizing the thermal contact conductance including the use of greases, metallic foils, and screens, composite materials and cements, and surface treatments are reviewed. The relative merits of the various enhancement techniques are summarized and comparisons are made for selected thermal enhancement materials. The results should prove useful in selecting thermal enhancement materials for use in improving the thermal performance of specific electronic systems

Published in:

IEEE Transactions on Components, Hybrids, and Manufacturing Technology  (Volume:13 ,  Issue: 4 )