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Wetting interactions between the Ni-Cu-P deposit and In-Sn solders

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2 Author(s)
Chun-Jen Chen ; Dept. of Mater. Sci. & Eng., Nat. Cheng Kung Univ., Tainan, Taiwan ; Lin, Kwang-Lung

The interactions during wetting between an electroless Ni-Cu-P deposit and molten InSn solders were investigated with the aid of scanning electron microscope (SEM), X-ray diffractometer (XRD), and Auger electron spectroscope (AES). The intermetallics In3Ni 2 and In27Ni10 were formed at the interlayer for the Ni-Cu-P with 51In-49Sn and 80In-20Sn systems, in the temperature range of 250-300°C. In addition to these two intermetallic compounds Ni3Sn4 was also formed with the 20In-80Sn system. The Ni3Sn4 dissipates gradually with increasing temperature. A two-stage wetting mechanism was disclosed for the wetting of Ni-Cu-P deposit with the InSn solders in the temperature range of 250-325°C

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Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:20 ,  Issue: 3 )