Silicon nanofabrication technologies provide precise dimensional control and batch processing capability. These features have been exploited to enable novel active and passive components in the submillimeter-wave region. We report on silicon micromachined methodologies that will enable large format submillimeter-wave heterodyne arrays and 3-D integration of the whole receiver front-end.
Published in:
Infrared, Millimeter and Terahertz Waves (IRMMW-THz), 2011 36th International Conference on
Date of Conference: 2-7 Oct. 2011