Notification:
We are currently experiencing intermittent issues impacting performance. We apologize for the inconvenience.
By Topic

A Vacuum-Based Bonding Mechanism for Modular Robotics

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Garcia, R.F.M. ; Modular Robot. Lab., Univ. of Southern Denmark, Odense, Denmark ; Hiller, J.D. ; Stoy, K. ; Lipson, H.

We explore vacuum as bonding force for modular robotics. Vacuubes are a set of modules that propagate vacuum across their interfaces in order to generate adhesive forces to form and hold structures. We use analog circuits to simulate vacuum transients and understand critical design parameters and then validate these insights in experiments. A 49-module structure that employs vacuum bonding is demonstrated. We conclude that vacuum offers a relatively strong, simple, reliable, and power-efficient connection principle.

Published in:

Robotics, IEEE Transactions on  (Volume:27 ,  Issue: 5 )