By Topic

Characterizing the failure envelope of a conductive adhesive

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
D. Olliff ; Dept. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA ; M. Gaynes ; R. Kodnani ; A. Zubelewicz

The importance of flip chip technology is beginning to grow as the use of such technology is seen to be more and more advantageous. The search for alternatives to lead-based solder has also led to the study of conductive adhesives as a possible replacement for solder interconnect technology. Under a grant from DARPA, the IBM and Universal Instruments Corporations have sought to create a flip chip package using conductive adhesive interconnects. This paper presents the preliminary results of mechanical testing designed to determine the static failure envelope of the adhesive. A difference in fracture mode was observed between the tensile and compressive samples indicating that a change in failure mechanism occurred. Further work is being conducted in order to isolate the specific failure mechanisms involved

Published in:

Advanced Packaging Materials. Proceedings., 3rd International Symposium on

Date of Conference:

9-12 Mar 1997