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Ultrathin Silicon Chips of Arbitrary Shape by Etching Before Grinding

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3 Author(s)
S. Herwik ; Department of Microsystems Engineering (IMTEK), University of Freiburg, Freiburg, Germany ; O. Paul ; P. Ruther

A complementary-metal-oxide-semiconductor-compatible fabrication technique for ultrathin silicon chips of arbitrary shape is reported. It combines deep reactive ion etching and wafer grinding to define the in-plane geometry and thickness of the chips, respectively. Neural probes with shaft lengths up to 12 mm and thicknesses down to 25 μm were fabricated.

Published in:

Journal of Microelectromechanical Systems  (Volume:20 ,  Issue: 4 )