Cart (Loading....) | Create Account
Close category search window
 

Built-in self-test/repair scheme for TSV-based three-dimensional integrated circuits

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Hung-Yen Huang ; Dept. of Electr. Eng., Nat. Dong Hwa Univ., Hualien, Taiwan ; Yu-Sheng Huang ; Chun-Lung Hsu

This paper presents a built-in self-test/repair (BISTR) scheme for through-silicon via (TSV) based three-dimension integrated circuits (3D ICs). The proposed BIST structure focuses on the testing of a specific defective TSV by using a critical value of threshold. Then, the test results from BIST will be delivered to the BISR structure for repairing the defective TSV. Additionally, a parallel processing approach is presented of the proposed BISTR scheme to speed up the operations of test and repair. Experimental results demonstrate that the proposed BISTR scheme can achieve the good performance in repair rate and yield with little area overhead penalty.

Published in:

Circuits and Systems (APCCAS), 2010 IEEE Asia Pacific Conference on

Date of Conference:

6-9 Dec. 2010

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.