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Attaining Single-Chip, High-Performance Computing through 3D Systems with Active Cooling

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4 Author(s)

This article explores the benefits and the challenges of 3D design and discusses novel techniques to integrate predictive cooling control with chip-level thermal-management methods such as job scheduling and voltage frequency scaling. Using 3D liquid-cooled systems with intelligent runtime management provides an energy-efficient solution for designing single-chip many-core architectures.

Published in:

Micro, IEEE  (Volume:31 ,  Issue: 4 )