Referenced Items are not available for this document.
This paper describes a novel method of modeling the differential via on multilayered printed circuit boards (PCBs) used in high-speed digital designs based on the analytical equations for characteristic impedance and effective dielectric constant. In the absence of measured or electromagnetic simulated data traditionally needed to extract these parameters, this method can quickly and efficiently predict the behavior of the differential via holes on PCBs using a circuit simulator.
Published in:
Components, Packaging and Manufacturing Technology, IEEE Transactions on
(Volume:1
,
Issue:
5
)
Date of Publication: May 2011
- Page(s):
- 722 - 730
- ISSN :
- 2156-3950
- INSPEC Accession Number:
- 12004850
- Digital Object Identifier :
- 10.1109/TCPMT.2010.2103313
- Product Type:
- Journals & Magazines
- Date of Publication :
- 10 May 2011
- Date of Current Version :
- 16 May 2011
- Issue Date :
- May 2011
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