By Topic

Feature-Extraction-Based Inspection Algorithm for IC Solder Joints

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Fupei Wu ; Dept. of Mechantronics Eng., Shantou Univ., Shantou, China ; Xianmin Zhang

In order to inspect solder joint defects of integrated circuit (IC) components on printed circuit boards (PCBs), an automatic optical inspection (AOI) algorithm is developed. Firstly, considering the shape of a solder joint and its optical reflection property, the IC solder joint is divided into several subregions, which are called shape features. Secondly, the digital features that are used to evaluate the solder quality of the subregions are expressed by the color, area, mass center, and continuous pixels. Thirdly, the logical features are developed according to the color distributions of the solder joint image and the relationships between different subregions and the types of solder joints. Finally, to evaluate the performance of the proposed algorithm, 137 PCBs with defects were inspected by an AOI system that integrates with the proposed algorithm. Inspection results show that solder joint defects of IC such as surplus solder, lacking solder, no solder, lead lift, lead bend, shift, and bridged and pseudo joints can be identified effectively.

Published in:

Components, Packaging and Manufacturing Technology, IEEE Transactions on  (Volume:1 ,  Issue: 5 )