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TSV as an alternative to wire bonding for a wireless industrial product: another step towards 3D integration

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14 Author(s)
Druais, G. ; STMicroelectronics, Crolles, France ; Ancey, P. ; Chapelon, L.L. ; Charbonnier, J.
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3D integration development has to be driven by industrial demand and applications. To get interested in those technological developments, industrials shall be convinced by benefits of Through Silicon Vias (TSV) integration versus traditional assembly approach. This will demonstrate that this approach is worth being more developed and implemented. In this study, we demonstrated that we are able to achieve similar performance for a given product using a standard wire bonding packaging and an integration with TSV. Both electrical measurements on test structures and characterization on product are compared.

Published in:
Electronic System-Integration Technology Conference (ESTC), 2010 3rd

Date of Conference: 13-16 Sept. 2010

Page(s):
1 - 4
E-ISBN :
978-1-4244-8554-3
Print ISBN:
978-1-4244-8553-6
INSPEC Accession Number:
11665191
Conference Location :
Berlin
Digital Object Identifier :
10.1109/ESTC.2010.5642920
Product Type:
Conference Publications

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