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A model for moisture induced corrosion failures in microelectronic packages

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1 Author(s)
M. Pecht ; CALCE Center for Electron. Packaging, Maryland Univ., College Park, MD, USA

As integrated circuit geometries become smaller and package sizes and I/O counts increase, there is an increased potential of failures resulting from moisture ingress and corrosion. To aid in reliability prediction, design for reliability, and assessing reliability tradeoffs, a methodology for coupling the mechanisms of moisture ingress and corrosion in microelectronic packages into a first-order failure-rate model is presented. The model focuses on aluminum metallization corrosion resulting from chlorine-based contaminants, but is general enough to be applied to other cases

Published in:

IEEE Transactions on Components, Hybrids, and Manufacturing Technology  (Volume:13 ,  Issue: 2 )