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Full wave three-dimensional simulation of Maxwell's equations for the electrical characterization of high-speed interconnects

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2 Author(s)
F. J. German ; Dept. of Electr. Eng., Auburn Univ., IL, USA ; R. W. Johnson

A complete three-dimensional full wave time-domain analysis of microstrip-type interconnections is presented. The analysis technique used in the transmission line matrix (TLM) method of electromagnetic simulation using the newly developed symmetrical condensed node. No TEM-quasistatic assumptions are required; therefore, all electromagnetic interactions-such as surface waves and radiation effects-are accounted for. Several practical structures are examined, and comparisons are made to other methods and with measurements where available

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IEEE Transactions on Components, Hybrids, and Manufacturing Technology  (Volume:13 ,  Issue: 2 )