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Silicon photonics is a new technology that should at least enable electronics and optics to be integrated on the same optoelectronic circuit chip, leading to the production of low-cost devices on silicon wafers by using standard processes from the microelectronics industry. In order to achieve real-low-cost devices, some challenges need to be taken up concerning the integration technological process of optics with electronics and the packaging of the chip. In this paper, we review recent progress in the packaging of silicon photonic circuits from on-CMOS wafer-level integration to the single-chip package and input/output interconnects. We focus on optical fiber-coupling structures comparing edge and surface couplers. In the following, we detail optical alignment tolerances for both coupling architecture, discussing advantages and drawbacks from the packaging process point of view. Finally, we describe some achievements involving advanced-packaging techniques.