By Topic

Application of WLP with barrier trench structure in precision screen printing technology by glass frit

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
Xiao Chen ; Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, 200050, China ; Pei-li Yan ; Jia-jie Tang ; Wen-guo Ning
more authors

This paper reports on glass frit wafer bonding, which is a universally usable technology for Micro-Electronics Mechanical System (MEMS) wafer level encapsulation and packaging. The package process demonstrated from DEK-APi screen printing of glass frit, firing to wafer bonding by glass frit. However, the dimensions of glass frit after bonding are nonuniform and some frit widens to reach MEMS device, resulting in package failure. A new improved technology (Barrier trench technology, BTT) is developed. And in process of bonding, glass frit expanding in bonding force is resisted by the BTT. The uniformity of bonded glass frit dimension can be achieved. It allows hermetic sealing and a high process yield. And shear test, water test for the gross leak and fine leak test results fulfilled the corresponding MIL-STD.

Published in:

Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on

Date of Conference:

16-19 Aug. 2010