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Package level failure analysis: New techniques and new instruments for better results

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3 Author(s)
Pappalardo, S. ; ST Microelectron., Agrate Brianza, Italy ; Caccialanza, D. ; Mdsarip, Z.

In this paper we propose an integrated method for effective failure analysis at device package level. For this reason, some well-known techniques will be reviewed and some new methodologies proposed, in the effort of building an organic flow, able to localize the defect, highlight its physical attributes and so leverage the root cause identification.

Published in:

Quality Electronic Design (ASQED), 2010 2nd Asia Symposium on

Date of Conference:

3-4 Aug. 2010