By Topic

Fast Placement-Aware 3-D Floorplanning Using Vertical Constraints on Sequence Pairs

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Nain, R.K. ; Electr. & Comput. Eng. Dept., Portland State Univ., Portland, OR, USA ; Chrzanowska-Jeske, M.

We present a placement-aware 3-D floorplanning algorithm that considers 3-D-placement of logic gates inside modules for wirelength minimization. It allows designers to introduce and evaluate an assignment of vertically-aligned parts of the same module to different device layers. A set of vertical constraints is derived on sequence pairs of different device layers that reduces the solution space, and a fast packing algorithm with vertical constraints enables quick floorplan evaluation. Experimental results on MCNC and GSRC benchmarks show that our algorithm can generate a good floorplanning solution with reduced wirelength inside modules and optimized footprint area while controlling the number of vias. Compared to the existing state-of-the-art 3-D floorplanning algorithms, our tool reduces the system level total wirelength by 9.8%.

Published in:

Very Large Scale Integration (VLSI) Systems, IEEE Transactions on  (Volume:19 ,  Issue: 9 )