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Modeling and experimental verification of the interconnected mesh power system (IMPS) MCM topology

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3 Author(s)
Low, Y.L. ; Lucent Technologies, AT&T Bell Labs., Murray Hill, NJ, USA ; Schaper, L.W. ; Ang, S.S.

A new low-cost multichip module (MCM) topology, the interconnected mesh power system (IMPS), has been shown capable of reducing the metal layers of a conventional four-layer MCM by half. To provide a complete MCM on only two metal layers, the IMPS topology provides a unique and complex power distribution system and signal transmission environment. This paper reports on models of the IMPS structure based on finite-difference/partial-inductance methods and PSpice simulation. The models can easily he constructed using a commercial three-dimensional (3-D) field solver and the circuit models can be solved by PSpice. The agreement between the modeled and measured results is excellent. Discrepancies between models and results are also discussed

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Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:20 ,  Issue: 1 )