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Special Issue on PCB Level Signal Integrity, Power Integrity, and EMC

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2 Author(s)
Kim, J. ; Korea Advanced Institute of Science and Technology (KAIST), Electrical Engineering and Computer Science Department, Daejeon , Korea ; Li, E.

The 24 papers in this special issue highlight recent significant advancements and innovations related to printed circuit board (PCB) signal integrity (SI), power integrity (PI), electromagnetic emission and susceptibility modeling, design, and measurement technologies.

Published in:
Electromagnetic Compatibility, IEEE Transactions on  (Volume:52 ,  Issue: 2 )

Date of Publication: May 2010

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