By Topic

A new anisotropic conductive film with arrayed conductive particles

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Ishibashi, K. ; AMP Technol. Japan Ltd., Kanagawa, Japan ; Kimura, J.

A new anisotropic conductive film (ACF) incorporating arrayed metal conductors in an adhesive polymer film is proposed. A photoresist pattern with a number of round holes arrayed in triangular arrangement is formed on a stainless steel substrate. The holes are then electroplated to form metal bumps, using the substrate as a cathode. After removal of the photoresist, the substrate is laminated with a solid adhesive film. Finally, the ACF of arrayed metal bumps is obtained when the adhesive film is peeled off and the metal bumps are transferred from the substrate to the adhesive film. The superior interconnection properties of the proposed ACF, compared with conventional ACFs that rely on randomly distributed conductive particles, are attributed to the arrayed, uniformly sized particles in the adhesive film

Published in:

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:19 ,  Issue: 4 )