Referenced Items are not available for this document.
A new anisotropic conductive film (ACF) incorporating arrayed metal conductors in an adhesive polymer film is proposed. A photoresist pattern with a number of round holes arrayed in triangular arrangement is formed on a stainless steel substrate. The holes are then electroplated to form metal bumps, using the substrate as a cathode. After removal of the photoresist, the substrate is laminated with a solid adhesive film. Finally, the ACF of arrayed metal bumps is obtained when the adhesive film is peeled off and the metal bumps are transferred from the substrate to the adhesive film. The superior interconnection properties of the proposed ACF, compared with conventional ACFs that rely on randomly distributed conductive particles, are attributed to the arrayed, uniformly sized particles in the adhesive film
Published in:
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
(Volume:19
,
Issue:
4
)
Date of Publication: Nov 1996
- Page(s):
- 752 - 757
- ISSN :
- 1070-9894
- INSPEC Accession Number:
- 5438367
- Digital Object Identifier :
- 10.1109/96.544366
- Product Type:
- Journals & Magazines
- Date of Current Version :
- 06 August 2002
- Issue Date :
- Nov 1996
- Sponsored by :
- IEEE Components, Packaging, and Manufacturing Technology Society
About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies
A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.
