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Multi-step three dimensional micro assembly for a flexible LED display

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3 Author(s)
Yu-Ruei Chiou ; National Changhua University of Education, Taiwan ; Shih-Ya Huang ; Kerwin Wang

This paper presents a novel multi-step three dimensional microassembly of passive-circuit-mesh, conductive beads, and LED chips to fabricate a flexible, bright, and wide viewing angle display. A novel flexible display architecture is proposed. To deliver this design, we focus our efforts on the multi-batch assembly integration. A 3-by-3 light-emitting diode array with a chip size of 610 ¿m by 610 ¿m by 90 ¿m is successfully prototyped with device fill factor up to 37.97%. It yields a 990 ¿m squared monochromatic pixel.

Published in:

Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on

Date of Conference:

24-28 Jan. 2010