Cart (Loading....) | Create Account
Close category search window

Integrated on-chip antennas using CMOS circuit ground planes

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Yordanov, H. ; Inst. for High Freq. Eng., Tech. Univ. Munchen, Munich, Germany ; Russer, P.

Wireless communication is an alternative for increasing the chip-to-chip interconnects data rate. Integrated antennas are the most chip area demanding elements of an integrated wireless link. This work investigates the possibility of using the already available on-chip elements like the power supply metallization as a radiating structure, thus integrating the antennas without occupying significant chip area. The operation mode of such antennas is presented and various structures are investigated. The influence of the CMOS interconnects on the antennas has been studied. An experimental setup for verifying the properties the proposed antenna structures has been designed.

Published in:

Silicon Monolithic Integrated Circuits in RF Systems (SiRF), 2010 Topical Meeting on

Date of Conference:

11-13 Jan. 2010

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.