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Thermomechanical modeling of 3D electronic packages

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4 Author(s)
S. M. Sri-Jayantha ; IBM Research Division, Thomas J Watson Research Center, P.O. Box 218, Yorktown Heights, New York 10598, USA ; G. McVicker ; K. Bernstein ; J. U. Knickerbocker

Development of complex electronic packages requires a judicious combination of experimentation and modeling. Fabrication costs of electronic packaging prototypes can be prohibitive; therefore, the building of effective virtual prototypes provides an important challenge for the modeling community. Fortunately, finite-element modeling (FEM) has become sufficiently mature to allow technologists to develop reliable insights into the thermal and mechanical integrity of proposed structures. For modeling to be leveraged as an effective means of avoiding thermally related mechanical problems, the diversity in size scale found in three-dimensional electronic packages must be carefully considered and addressed. Employing three distinct examples, we summarize our experience and insights in applying FEM in order to make informed decisions in the early stages of product package research and development.

Note: The Institute of Electrical and Electronics Engineers, Incorporated is distributing this Article with permission of the International Business Machines Corporation (IBM) who is the exclusive owner. The recipient of this Article may not assign, sublicense, lease, rent or otherwise transfer, reproduce, prepare derivative works, publicly display or perform, or distribute the Article.  

Published in:

IBM Journal of Research and Development  (Volume:52 ,  Issue: 6 )