Referenced Items are not available for this document.
Multichip Modules (MCMs) use complex digital, analog, and mixed-signal chips on a single substrate from different vendors. To ensure quality of die and the functionality and performance of MCMs, extensive testing is required at all levels. This paper presents structured test methodologies for MCMs. The economics associated with these methodologies and their relative cost at the MCM level are also presented
Published in:
Test Conference, 1995. Proceedings., International
Date of Conference: 21-25 Oct 1995
- Page(s):
- 193 - 201
- Meeting Date :
- 21 Oct 1995-25 Oct 1995
- ISSN :
- 1089-3539
- Print ISBN:
- 0-7803-2992-9
- INSPEC Accession Number:
- 5261342
- Conference Location :
- Washington, DC
- Digital Object Identifier :
- 10.1109/TEST.1995.529833
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