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The fabrication process of a 12-channel parallel optical transceiver module developed in our group is presented in this paper. The module is composed of a VCSEL array, a PIN PD array, a VCSEL driver chip, a TIA/LA chip and supporting PCB and connector. A SiOB and its vertical assembly are emphasized as the highlights of the structure of this module, which is promising to effectively reduce the package cost and improve the optical coupling efficiency.
Published in:
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Date of Conference: 10-13 Aug. 2009
- Page(s):
- 28 - 30
- E-ISBN :
- 978-1-4244-4659-9
- Print ISBN:
- 978-1-4244-4658-2
- INSPEC Accession Number:
- 10894115
- Conference Location :
- Beijing
- Digital Object Identifier :
- 10.1109/ICEPT.2009.5270802
- Product Type:
- Conference Publications
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