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Ecodesign technical committee of JIEP (Japan Institute of Electronics Packaging) and its activity

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1 Author(s)
Hayashi, H. ; Eco-Design & Jisso Tech. Comm. of JIEP, NPO Ecodesign Promotion Network, Japan

The discussions on environmental issue in electronics industry in the past are mostly on the regulation oriented technical issues to follow the needs of rapid increase on environmental regulations. We have reported in JIEP (Japan Institute of Electronics Packaging) session in EcoDesign2001 as EcoDesign JIEP Tomorrow [1]. Even if there are still many disputes, we could show the electronics industry in Japan is about to full fill most of all requirements stated in EcoDesign for tomorrow that was based on the global regulative scheme until 2010. Then our focus should shift to the future task that is more radical and challenging but difficult one. This paper introduces activity of JIEP and EcoDesign & Jisso Technical Committee in the past and direction of study forward to the future. We pay special attention on saving, reliability on RoHS alternative material, reliability on easy decomposition structure, lifetime extension and emerging new technologies for the future. Those subjects are sometimes in trade-off relations of performance and environmental aspect.

Published in:

Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on

Date of Conference:

10-13 Aug. 2009

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