Cart (Loading....) | Create Account
Close category search window

Particle coating in seeded dusty plasma reactor: Distribution of deposition rates

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Cao, Jin ; Department of Chemical Engineering, The Pennsylvania State University, University Park, Pennsylvania 16802 ; Matsoukas, T.

Your organization might have access to this article on the publisher's site. To check, click on this link: 

We seed a low-pressure radio-frequency plasma with micron and submicron silica particles and induce surface deposition of plasma-generated solid films. This process produces surface coatings ranging from few nm to several hundred nm. The size distribution of the coated particles (core plus shell) is monitored as a function of time and is found to increase both in mean size as well as in variance. To explain the broadening of the distribution we propose a deposition model which assumes that the reaction rate is nonuniform within the plasma. This model predicts that the average particle radius increases linearly with deposition time with a slope equal to the average deposition rate while the variance increases as a quadratic function of time. These predictions compare favorably with experiments conducted with seeds ranging 0.1–2.3 μm in radius. Based on this model we are able to obtain the distribution of film deposition rates in the plasma. We find that this distribution is wide with a substantial fraction of particles experiencing very low deposition rates. © 2003 American Vacuum Society.

Published in:

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures  (Volume:21 ,  Issue: 5 )

Date of Publication:

Sep 2003

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.