By Topic

The removal of hydrocarbons and silicone grease stains from silicon wafers

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Sherman, Robert ; Group Technical Center, The BOC Group, Inc., Murray Hill, New Jersey 07974 ; Whitlock, Walter

Your organization might have access to this article on the publisher's site. To check, click on this link:http://dx.doi.org/+10.1116/1.585010 

A relatively new method of removing hydrocarbon and silicone grease stains from silicon wafer surfaces is discussed. In this technique, high purity liquid or gaseous CO2 is expanded in a special nozzle to form a high speed jet. The jet contains numerous small diameter particles of solid CO2. The CO2 particles, referred to as snow, strike the surface and remove adherent particles (even submicron sizes), hydrocarbon stains such as fingerprints and noseprints, and silicone grease. Indeed, CO2 snow cleaning of clean wafer surfaces has led to sizable reductions in the adventitious hydrocarbons; in one case, the reduction was about 60%. Surface analysis of clean and contaminated silicon wafers indicates that CO2 snow cleaning causes no apparent chemical interactions and leaves no detectable residues.

Published in:

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures  (Volume:8 ,  Issue: 3 )