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A recent review of plasma etching is extended with discussions of similarity variables governing discharges, anisotropic oxide etching in fluorine and unsaturate‐rich plasmas, surface texture, the loading effect, and gas‐surface reactions.
Published in:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
(Volume:1
,
Issue:
1
)
Date of Publication: Jan 1983