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Understanding the use of silicone gels for nonhermetic plastic packaging

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3 Author(s)
C. P. Wong ; AT&T Bell Lab., Princeton, NJ, USA ; J. M. Segelken ; J. W. Balde

The authors review some potential IC encapsulants, with special focus on the high-performance silicone gel, its chemistry, and its use as a VLSI device encapsulant for single and multichip applications. It is noted that high-performance silicone gel possesses excellent electrical and physical properties for IC protection. With their intrinsic low modulus and soft gel-like nature, silicone gels have become very effective encapsulants for larger, high I/O, wire-bonded VLSI chips. Recent studies indicate that adequate IC chip surface protection with high-performance silicone gels in plastic packaging could replace conventional ceramic hermetic packaging

Published in:

IEEE Transactions on Components, Hybrids, and Manufacturing Technology  (Volume:12 ,  Issue: 4 )