By Topic

Effect of cooling rate on interfacial fatigue-crack growth in Sn-Pb solder joints

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Daping Yao ; Dept. of Mater. Sci. & Eng., Illinois Univ., Urbana, IL, USA ; Jian Ku Shang

The effect of the cooling rate after the reflow on the behavior of fatigue crack growth along Cu/Sn-Pb interfaces was examined in solder joints. Flexural peel specimens made from eutectic Sn-Pb solder alloy and Cu were cooled down from reflowing to room temperature using furnace cooling, air cooling, and water quenching. Kinetics of fatigue crack growth along the solder/Cu interface were measured from the flexural peel specimens as a function of strain energy release rate. The effect of cooling rate was found to depend on the level of strain energy release rate. Increasing the cooling rate from furnace cooling to water-quenching enhanced the fatigue crack growth resistance by up to more than 50% at low strain energy release rates, but reduced the fatigue crack growth resistance by up to 100% at high strain energy release rates. The enhanced fatigue crack growth resistance at the low strain energy release rates is shown to result from roughening of the interface with increasing cooling rate, while the reduction in the fatigue crack growth resistance at very high strain energy release rates followed the change in crack growth mechanisms from cohesive to interfacial

Published in:

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:19 ,  Issue: 1 )