Cart (Loading....) | Create Account
Close category search window
 

New optical and electrical hybrid packaging techniques using optical waveguides for optoelectronic multichip modules

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Koike, S. ; Interdisciplinary Res. Lab., Nippon Telegraph & Telephone Co., Tokyo, Japan ; Simokawa, F. ; Matsuura, T. ; Takahara, H.

An optoelectronic multichip module (OE-MCM) using fluorinated polyimide optical waveguides is proposed. This module can be produced with an optoelectrical substrate (OE-substrate), incorporating photodiode-to-waveguide coupling, and fiber-to-waveguide coupling. The OE-substrate is composed of fluorinated polyimide optical waveguides fabricated onto a copper-polyimide multilayer electrical substrate. Propagation loss of the optical waveguide is low at 0.4 dB/cm. There is no change in the optical characteristics of the waveguide after heat-treatment during the solder bonding process. The waveguide-to-photodiode coupling is achieved by deflecting the propagating light with a total internal reflection (TIR) mirror, and self-alignment of the photodiode is achieved using micro-solder bumps. The TIR mirror shows low reflection loss of less than 1.5 dB. The solder bumps can position the photodiode accurately within ±1 μm. A fiber guiding groove is used for alignment-free coupling between inter-modules. The coupling loss between the fiber and the waveguide is estimated to be 3.2 db with the deviation of about 0.1 dB. These techniques make OE-MCM's attainable

Published in:

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:19 ,  Issue: 1 )

Date of Publication:

Feb 1996

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.