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New optical and electrical hybrid packaging techniques using optical waveguides for optoelectronic multichip modules

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4 Author(s)
Koike, S. ; Interdisciplinary Res. Lab., Nippon Telegraph & Telephone Co., Tokyo, Japan ; Simokawa, F. ; Matsuura, T. ; Takahara, H.

An optoelectronic multichip module (OE-MCM) using fluorinated polyimide optical waveguides is proposed. This module can be produced with an optoelectrical substrate (OE-substrate), incorporating photodiode-to-waveguide coupling, and fiber-to-waveguide coupling. The OE-substrate is composed of fluorinated polyimide optical waveguides fabricated onto a copper-polyimide multilayer electrical substrate. Propagation loss of the optical waveguide is low at 0.4 dB/cm. There is no change in the optical characteristics of the waveguide after heat-treatment during the solder bonding process. The waveguide-to-photodiode coupling is achieved by deflecting the propagating light with a total internal reflection (TIR) mirror, and self-alignment of the photodiode is achieved using micro-solder bumps. The TIR mirror shows low reflection loss of less than 1.5 dB. The solder bumps can position the photodiode accurately within ±1 μm. A fiber guiding groove is used for alignment-free coupling between inter-modules. The coupling loss between the fiber and the waveguide is estimated to be 3.2 db with the deviation of about 0.1 dB. These techniques make OE-MCM's attainable

Published in:

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:19 ,  Issue: 1 )

Date of Publication:

Feb 1996

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