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Efficient transient simulation of lossy packaging interconnects using moment-matching techniques

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2 Author(s)
M. Celik ; Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA ; A. C. Cangellaris

This paper introduces enhancements to moment-matching techniques for rapid time-domain computer simulation of packaging interconnect structures. New moment calculating methods are proposed to handle dispersive, lossy interconnects and related package discontinuities, transitions and junctions that are modeled in terms of either numerically extracted or measured frequency-dependent, equivalent transmission line parameters, or scattering parameters. Computer simulations of pulse propagation in interconnects with frequency-dependent ohmic losses are used to demonstrate the validity and accuracy of the proposed methods

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IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B  (Volume:19 ,  Issue: 1 )