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High-performance nMOSFET with in-situ phosphorus-doped embedded Si:C (ISPD eSi:C) source-drain stressor

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39 Author(s)
B. Yang ; Adv. Micro Devices, Hopewell Junction, NY ; R. Takalkar ; Z. Ren ; L. Black
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For the first time, embedded Si:C (eSi:C) was demonstrated to be a superior nMOSFET stressor compared to SMT or tensile liner (TL) stressors. eSi:C nMOSFET showed higher channel mobility and drive current over our best poly-gate 45 nm-node nMOSFET with SMT and tensile liner stressors. In addition, eSi:C showed better scalability than SMT plus tensile liner stressors from 380 nm to 190 nm poly-pitches.

Published in:

2008 IEEE International Electron Devices Meeting

Date of Conference:

15-17 Dec. 2008